Cu2SnSe3系、Mo3Sb7系“PGEC”型热电材料的制备及性能研究

目前能源危机和传统化石燃料的使用引起的环境问题日益受到了人们的重视，而且航空航天和微电子等领域电子元件的冷却也急需新的制冷技术。热电材料作为一种新型的功能材料，能够实现热能和电能的直接相互转换，非常有希望成为解决上述两个问题的有效途径之一。但直到目前为止已发现的热电材料性能仍较低，限制了其进一步大规模的使用。“声子玻璃，电子晶体”（PGEC）类热电材料的概念由Slack最早提出，由于此类材料结构上的特性，使得其具有成为高性能热电材料的巨大潜力。在本论文中我们主要介绍了Cu2SnSe3和Mo3Sb7这两种具有PGEC结构的热电材料，并通过掺杂分别优化了它们的热电性能。主要的研究内容和成果如下： （1）采用传统固相法结合SPS快速烧结技术制备了Ga掺杂的Cu2Sn1-xGaxSe3(x = 0, 0.05, 0.08, 0.11)热电材料，X射线粉末衍射（XRD）结果表明Ga掺杂量达到0.11...Currently, the energy crisis and environmental problem from the combustion of traditional fossil fuels have attracted more and more attention, and the cooling of electronic components in the field of aerospace and microelectronics urgently require new refrigeration technology. Thermoelectric materials, as new functional materials, are capable of converting waste heat into electricity, and can offer a promising solution for the above crises and cooling requirements. However, the further widespread use of thermoelectric devices has been largely frustrated by their low efficiency. The concept of the “phonon glass electron crystal” (PGEC) is firstly proposed by Slack. Because of the special structure, theses materials have great potential to be high competitive thermoelectric materials. In thi..